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| BULD39D-1 BULD39DT4 High Voltage Fast-Switching NPN Power Transistor General features NPN transistor High voltage capability Minimum lot-to-lot spread for reliable operation Very high switching speed High ruggedness Surface-mounting DPAK (TO-252) power package in tape & reel (suffix "T4") Through-hole IPAK (TO-251) power package in tube (suffix "-1") In compliance with the 2002/93/EC European Directive 1 2 3 1 3 IPAK TO-251 (suffix "-1") DPAK TO-252 (suffix "T4") Description The device in manufactured using high voltage Multi-epitaxial Planar technology to enhance switching speeds while maintaining wide RBSOA. The BUL series is designed for use in electronics transformer for halogen lamps. Internal schematic diagram Applications Electronics transformer for halogen lamps Switch mode power supplies Order codes Part Number BULD39D-1 BULD39DT4 Marking Package IPAK DPAK Packing Tube Tape & reel May 2006 Rev 1 1/12 www.st.com 12 BULD39D-1 - BULD39DT4 Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 2.2 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2/12 BULD39D-1 - BULD39DT4 Electrical ratings 1 Electrical ratings Table 1. Symbol VCES VCEO VEBO IC ICM IB IBM Ptot Tstg TJ Absolute maximum rating Parameter Collector-emitter voltage (V BE = 0) Collector-emitter voltage (IB = 0) Emitter-base voltage (IC = 0) Collector current Collector peak current (tP < 5ms) Base current Base peak current (tP < 5ms) Total dissipation at T c = 25C Storage temperature Max. operating junction temperature Value 850 450 9 4 8 2 4 35 -65 to 150 150 Unit V V V A A A A W C C Table 2. Symbol Rthj-case Rthj-amb Thermal data Parameter Thermal resistance junction-case Thermal resistance junction-amb __max __max Value 3.57 62.5 Unit C/W C/W 3/12 Electrical characteristics BULD39D-1 - BULD39DT4 2 Electrical characteristics (Tcase = 25C unless otherwise specified) Table 3. Symbol ICES IEBO Electrical characteristics Parameter Collector cut-off current (VBE = 0) Emitter cut-off current (IC =0) Collector-emitter sustaining voltage (IB = 0) Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain Maximum collector emitter voltage without snubber Inductive load Storage time Fall time Diode forward voltage Test Conditions VCE = 850V VCE = 850V VEB = 9V Tj = 125C Min. Typ. Max. 100 500 100 Unit A A A VCEO(sus) VCE(sat) (1) IC = 100mA L = 25 mH IC = 1A IC = 2.5A IC = 1A IC = 2.5A IC = 10mA IC = 5A IC = 6A VBB= -2.5V tP 10s IC = 2.5A IB(on) = 0.5A VBE(off) = -5V RBB = 0 VCL = 300V L = 1mH IC = 2A IB = 0.2A IB = 0.5A IB = 0.2A IB = 0.5A V CE = 5 V CE = 10V R BB = 0 L = 50H 450 0.13 0.5 1.1 1.1 1.3 10 4 V V V V V VBE(sat) (1) hFE (1) VCEW 450 V ts tf Vf 0.7 50 1.5 100 1.5 s ns V Note (1) Pulsed duration = 300 s, duty cycle 1.5% 4/12 BULD39D-1 - BULD39DT4 Electrical characteristics 2.1 Electrical characteristics (curves) Figure 1. Safe operating area Figure 2. Derating curve Figure 3. DC current gain DC current gain Figure 4. Collector-emitter saturation voltage Figure 5. Base-emitter saturation voltage 5/12 Electrical characteristics Figure 6. Inductive load fall time Figure 7. BULD39D-1 - BULD39DT4 Inductive load storage time Figure 8. Reverse biased SOA 6/12 BULD39D-1 - BULD39DT4 Electrical characteristics 2.2 Test circuits Figure 9. Inductive load switching test circuit 1) Fast electronic switch 2) Non-inductive resistor 3) Fast recovery rectifier 7/12 Package mechanical data BULD39D-1 - BULD39DT4 3 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 8/12 BULD39D-1 - BULD39DT4 Package mechanical data TO-251 (IPAK) MECHANICAL DATA DIM. A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 V1 0.45 0.48 6.00 6.40 4.40 15.90 9.00 0.80 0.80 10o 0.30 0.95 0.60 0.60 6.20 6.60 4.60 16.30 9.40 1.20 1.00 0.018 0.019 0.237 0.252 0.173 0.626 0.354 0.031 0.031 10o mm MIN. 2.20 0.90 0.70 0.64 5.20 TYP. MAX. 2.40 1.10 1.30 0.90 5.40 0.85 0.012 0.037 0.024 0.024 0.244 0.260 0.181 0.642 0.370 0.047 0.039 MIN. 0.087 0.035 0.028 0.025 0.204 inch TYP. MAX. 0.094 0.043 0.051 0.035 0.213 0.033 P032N_E 9/12 Package mechanical data BULD39D-1 - BULD39DT4 TO-252 (DPAK) MECHANICAL DATA DIM. MIN. A A1 A2 B B2 C C2 D E G H L2 L4 V2 0.60 0o 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 0.8 1.00 8o 0.024 0o mm TYP. MAX. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 MIN. 0.087 0.035 0.001 0.025 0.204 0.018 0.019 0.236 0.252 0.173 0.368 0.031 0.039 0o inch TYP. MAX. 0.094 0.043 0.009 0.035 0.213 0.024 0.024 0.244 0.260 0.181 0.398 P032P_B 10/12 BULD39D-1 - BULD39DT4 Revision history 4 Revision history Table 4. Date 09-May-2006 Revision history Revision 1 Initial release. Changes 11/12 BULD39D-1 - BULD39DT4 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 12/12 |
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